The most important geometrical characteristic is the flatness of the entire wafer surface.
Wafers are also tested for inclusions and surface damage. The measuring speed requirements for process monitoring are sometimes very high.
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Applications
- 3D free-form workpieces
- Extruded workpieces
- Moulds
- Semiconductor workpieces
- Lithographic structures
- Metal-plastic composite workpieces
- Prismatic workpieces
- Stamped and bent parts
- Packaging
- Shaft-hub connections
- Shafts and axles
- Workpieces with micro-features
- Workpieces with optical functional surfaces
- Tools with geometrically defined cutting edges
- Tools with geometrically undefined cutting edges
- Gears
- Cylindrical workpieces
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