The new multi-spectral tomography (MSP-CT) enables high-resolution, low-artefact measurements of workpieces and assemblies that are difficult to scan. Previously, the measurement accuracy of larger cast aluminium workpieces, for example, was low due to strong artefacts. Measurements with low power and a small focal spot were time-consuming and led to a high structural resolution but strong artefacts. High power with a correspondingly larger focal spot increased the measuring speed but reduced the structural resolution.
Calculated point cloud with low measurement uncertainty and high structural resolution
With the new MSP-CT, a high-resolution measurement with low voltage and a fast measurement with high voltage can now be combined to produce a high-resolution measurement with low artefacts. The parameters of the X-ray source can be varied for this purpose, for example for a high-resolution measurement with low power and low voltage and a fast measurement with high power and high voltage. It is also possible to use two different X-ray sources, such as a microfocus transmission tube for high resolutions and a macrofocus reflection tube for fast measurements.
This means that even small structures can be measured on workpieces made of several materials that are difficult to penetrate, e.g. gap dimensions of the installation position of the printed circuit board and the corresponding plastic housing.
